AMiBA Engineering telecon

14, Mar, 2002

Chair: K.Y. Lo

Participants: R.Martin, D. Kubo (USA), M.Sinclair, M. Kesteven, W. Wilson (Sydney),

H. Wang, M.T. Chen, C.T. Li, Y.J. Hwang, H.M. Jiang, W. Ho, Y.D. Huang,

C.P. Ma, P. Shaw (Taipei)

Summary

 

MMIC:

1.      Huei and his student almost finish the chip design for InP HEMT LNA,he will send it to TRW by next week.

2.      Todd Gaier gave us a cost estimation for delivering 28 cold-tested amplifiers is about $65K,JPL will do everything. It will take 3-4 months to do the job. We need to deside what to do and get back to him ASAP.

3.      Bob received some test data and bias information from TRW, he will forward them to Huei and Mingtang shortly.

60cm Dish:

1.      Bob had a phone meeting with Miliflect to evaluate their design, basically they have to send  more revised specs and update the quote. Bob had several concerns about what they do; Miliflex's dish  has a single structure, its thickness is about 9mm, and we really need Philippe to take a FEA study to check its strength. Bob think it's will be a good idea for somebody to visit Miliflect to see how do they make the dish surface to meet our specs.

Receiver

1.      Mingtang has sorted out the dish interface  with Bob, and platform interface with Philippe, and Philippe will modify the drawing accordingly.

2.      Far field range measurement out door is under preparation, Ph. D. students C.P.Ma  and K.Y. Lin  are working on that.

3.      To measure the Inter-coupling between two 30cm dishes in lab, we need two dishes. Bob will modify the focus distance of the 30cm dish and then send to Taipei.

Platform:

We need to think about the alternative if Vertex hexapod mount doesn't work.

Correlator:

1.      Derek has generated the first version of correlator and circulated for comment as well , he got comment back from C.T. & Warwick and will incorporate those with the specs.

2.      More updates on the action items for March meeting , please read a summary prepared by Derek as attached.

Action items:

1.      Bob/    Whatever Bob have sent to Miliflect, he will send a copy to Mingtang also, so that Mingtang could follow up with the local manufacturer for quote. Bob will send the specs to Miliflect and CMA tomorrow.

2.      Bob/    Bob will talk to Philippe to figure out when they can finish the design and get all bid document ready for platform.

3.      Bob/    Bob will provide Mingtang the other source information of receiver cold head, and Mingtang will follow up to get quote.

4.      Mingtang/     Mingtang will figure out the over all power requirement on site for receiver, chiller and compressor and send to Bob ASAP.

5.      Bob/     Bob will follow up to organize a team and figure out a schedule required for prototype test and operation on site.

6.      Paul/     Paul will set up a separate telecon for correlator group to discuss the details of IF distribution.

Next meeting:   Thursday, March, 21, 8:30AM Taipei time.